HBM SoC Physical Design Engineer Intern

Micron Technology, Inc. is seeking a SoC Physical Design Intern on the HBM team in the United States.

You will support the implementation of advanced HBM SoC designs and gain hands-on experience in physical design methodologies, timing analysis, signoff flows, and automation. You will work with veterans across architecture, RTL, verification, DFT, and signoff, contributing to next-generation memory products for AI, HPC, and data centers.