HBM Product Failure & Yield Engineer

Micron Technology, Inc. in Boise, Idaho, is seeking an HBM Product Development Failure Analysis Engineer to join the PDFA team.

You will apply electrical, physical, and statistical analysis to identify failure mechanisms and drive corrective actions to enable high-yield production of next‑generation HBM devices. The role collaborates with Product, Process, Test, Quality and Manufacturing teams, leveraging AI-enabled analytics to accelerate failure detection, improve reliability, and support