Broadcom is seeking an experienced IC Package Design Manager to lead a world‑class team of engineers designing high‑speed flip‑chip‑BGA packages for AI, networking, HPC, and 5G applications. You will guide technical methodologies, project management, and cross‑functional collaboration across global time zones.
The role requires strong leadership, extensive package design experience, and the ability to drive complex programs on site in San Jose, CA. Occasional travel may be required.
#J-18808-LjbffrGlobal ASIC Package Design Lead – High-Speed SerDes BGA in san jose at Unknown Company
This position is listed as full time and onsite.