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Field Process Engineer - High Volume Manufacturing/Field Applications

Date:

Aug 27, 2026

Location:

Remote Texas, TX, US

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Job Function:

Technical

Business Unit:

Plasma Technology

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Location: Texas (Houston or DFW)

Business Unit: PT -Service - OI Americas based in Concord, MA

Reports To: Field Process Service Manager

Travel: Up to 50% | FLSA: Exempt

Position Summary

Oxford Instruments is seeking a Process Engineer - High Volume Manufacturing (HVM) / Field Applications to support advanced plasma processing systems across semiconductor manufacturing environments. This role blends field service expertise with process engineering ownership, supporting tool performance, customer acceptance, yield optimization, and uptime in 24/7 high-volume manufacturing (HVM) operations. This role is ideal for experienced engineers-particularly those from or with experience with - Lam Research, Applied Materials, or Tokyo Electron (TEL)-who bring strong tool knowledge and want to expand into process optimization, troubleshooting leadership, and customer-facing engineering. The position requires hands-on engagement with plasma etch/deposition systems, vacuum systems, chamber maintenance, wet cleans, contamination control, and process recovery within a fast-paced manufacturing environment.

Key Responsibilities
Process Performance, Acceptance & Sustaining

* Lead tool validation, qualification, and customer acceptance activities
* Verify system performance against specifications
* Optimize plasma processes for yield and throughput
* Support production ramp into HVM
* Develop process recipes as needed from existing starting points
Process & Equipment Support
* Support daily fab operations
* Monitor chamber and tool performance
* Analyze trends and implement fixes

Key Technical Activities
* Plasma chamber mfg quals & cleans as needed
* Vacuum, RF, electrical & PLC control troubleshooting
* Process qualification excursion engineering
* Particle mitigation

Required Qualifications
* Bachelor's degree in STEM field
* 3-8+ years experience
* Plasma tool (dep or etch) experience
* PLC control circuits troubleshooting skills
* Vacuum and RF knowledge

Preferred Qualifications
* Lam/Applied/TEL experience
* ICP/RIE/ALD/PECVD/ICPCVD
* HVM experience
* Contamination control
* Thin film metrology

KPIs
* Tool uptime
* Yield improvement
* SPC stability
* MTTR, MTBC
* Customer satisfaction

Work Environment
* Cleanroom PPE
* Physically active
* Travel up to 50%

Compensation : The expected salary for thisfull-time, benefited position is between$100,000 - $120,000 . The actual compensation will be determined considering factors such as relevant skills and experience and other factors permitted by law.

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