Qualcomm Technologies, Inc. is seeking a Failure Analysis Engineer to lead FA test interfaces, advanced socketing, and thermal management solutions for EFI across mobile, compute, automotive, and other platforms.
You will enable design debug, yield improvement, and RMA analysis by developing hardware methodologies and scalable interfaces, partnering with Design, Yield, Reliability, and Product teams to meet evolving requirements.
#J-18808-LjbffrFailure Analysis Lead: FA Test Interfaces & Thermal Solutions in san diego at Unknown Company
This position is listed as full time and onsite.