Company Overview QP Technologies (formerly Quik-Pak), a division of Promex is a family-owned microelectronics assembly and product company based in Escondido, California. Founded in 1992, QP Technologies serves over 400 customers annually and is a trusted U.S. provider of on-shore, quick-turn semiconductor packaging services supporting new device and product development. S. microelectronics, defense, and aerospace sectors and domestic reshoring prioritization.
This hands-on leader owns end-to-end process development, refinement and sustainment of our high mix/volume microelectronics packaging technology.Most critically, the successful applicant will leverage their core competencies in fundamental Engineering principles to design and scale a world-class Molding operation, manage the team, and influence end-to-end microelectronics process solutions for customers in our Escondido, CA factory.
Benchmark our existing Molding process and toolset by identifying root causes impacting product quality and yield at a first principles level through detailed problem solving and supporting data analysis Use design of experiments to identify and validate best consumables such as mold compound, cleaning agents, and epoxies Develop optimized recipes that cater to a range of products and form factors while creating a strong process with margin that caters for variations in product and materials Lead strategic selection and deployment of required capital equipment to scale process Adopt best known methods for process control that efficiently monitors process health over time, taking account of changeovers, preventive maintenance and event recovery Establish DFM rules to ensure designs and process windows are aligned for cost, quality and throughput
7+ years of experience in Transfer- or Injection-molding Manufacturing Engineering in a volume environment
Bachelor's degree in Mechanical Engineering or equivalent
Solid proficiency in SolidWorks for design work and revision control
Microelectronics/medical/aerospace domain knowledge not required — strong curiosity and willingness to learn these spaces matters more
Experience with overmolding using thermoset materials (microelectronics applications are a plus), micro-molding, or accommodating complex parts comprised of mixed materials
Engineering Manager - Molding and Packaging in escondido at Unknown Company
This position is listed as full time and onsite.