QP Technologies in Escondido, CA is seeking a hands-on leader to own end-to-end molding process development for high mix/volume microelectronics packaging. You will design and scale a world-class molding operation, manage the team, and influence process solutions for demanding customers.
The role emphasizes root-cause analysis, DOE, recipe optimization, supplier collaboration, and implementing robust process controls and DFM rules to balance cost, quality, and throughput.
#J-18808-LjbffrEngineering Leader, Molding & Packaging for Microelectronics in escondido at Unknown Company
This position is listed as full time and onsite.