Raytheon Technologies, Advanced Technology sector, seeks an Engineering Project Leader to drive strategy and development of a microelectronics packaging portfolio, including 2.5D and 3D heterogeneous integration. You will guide CRAD programs, craft proposals, and collaborate across Raytheon to mature concepts into programs.
This onsite role supports multiple locations including Goleta, CA, and requires Top Secret clearance.
#J-18808-LjbffrEngineering Lead — Microelectronics Packaging (2.5D/3D) in goleta at Unknown Company
This position is listed as full time and onsite.