Failure Analysis TechnicianLocation: Chandler, AZ Duration: 12 to 18 MonthsThis is an on-site role 100% of the time. Laptop will be issued for this role. The candidate will be responsible for conducting failure analysis needed to identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.Skill sets required not limited to the following:Demonstrated skills in X-section/planar polishing, optical microscopy imaging, and SEM/EDX on printed circuit board are preferred.
Knowledge of packaging material property and behavior is beneficial.Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.Minimum educational qualification is an AS degree in science or engineering and 2-4 years' experience in failure analysis, material analysis, process development or analytical tool development. Must be able to stand and work for at least 6 hours.