End-to-End Silicon Packaging Architect

Intel Corporation is seeking a senior Silicon Packaging Design Architect to lead end-to-end package solutions for physical, electrical, and cost requirements in the United States. You will drive design-to-production transitions and partner with cross-functional teams to push Intel's advanced packaging technologies.

The role emphasizes collaboration with silicon, hardware, and package teams, tradeoff decisions to meet standards, and ongoing process improvements to quality and cost targets.