ElectroMechanical Packaging Engineer (Hardware Protection Focus)

Electro Mechanical EngineerYou will be the Electro Mechanical Engineer for the Hardware Engineering team at Lockheed Martin Missiles and Fire Control (MFC). Our team delivers precision engagement aerospace and defense systems, designing, building and fielding the electrical hardware that powers missiles, sensors and other mission critical subsystems for the United States and allied militaries.As the Electro Mechanical Engineer, you will have ownership of package hardware design, heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed 3DHI packages throughout their operational lifespans. Your responsibilities will include:Design multichip package devices, including package substrates, Integrated Heat Spreaders and attach mechanism, stiffeners, and complex thermal management system integration to manage high thermal dissipation requirements.Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including operation shock and vibration.Define and execute packaging qualification plans adhering to project requirements, JEDEC and MIL-SPEC standardizations (e.g., Highly Accelerated Stress Testing / HAST).Investigate and perform failure analysis loops on critical component interface and intermetallic connections including anomalies like cracked solder joints, delaminated layers, and warped package substrates.

Implement corrective actions to mitigate identified failure modes in manufacturing and incorporate findings into product revisions while capturing lessons learned for future development activity.Architecting, designing, and validating advanced circuit card packagesDesigning high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraintsDesigning and developing electromechanical systems for advanced programs, special programs, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and sub-assembliesLeading and documenting design assurance reviews, tracking issues, and driving corrective actions to closurePerforming thermal, signal integrity, and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environmentsCoordinating with cross-functional teams — systems, hardware, software, test, and supply chain — to deliver high-quality results on schedule and within budgetManaging risk, schedule, and earned value metrics, and reporting status to senior leadershipWhy Join UsDo you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security.Further Information About This OpportunityThis position is in Orlando, FL. Discover more about our Orlando, Florida location.MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access.

The selected candidate must be able to obtain a secret clearance.Basic QualificationsBachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university; Master's degree or PhD preferred or Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree3D Heterogeneous Integration (3DHI)Advanced PackagingTechnical or project leadership experience supporting the production of high-reliability electronics productsMicroelectronics designProficient in CREO modeling and electromechanical system designProject leadership/management experience throughout the engineering/production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM)Experience in presentation, oral and written communication to facilitate effective and efficient interchanges between co-workers, leaders, and customersExperience working with cross-functional teams across multiple locationsExperience capturing flowed and derived requirements for electromechanical designsMust be a US Citizen; must possess or be able to obtain a DoD Secret security clearanceDesired SkillsThermal Interface Materials (TIM1/TIM2)Lid AttachPackage Stiffener RingsJEDEC QualificationHASTThermo-mechanical StressMultiphysics modelingDirect experience supporting production (manufacturing and test)Demonstrated leadership skills and behaviors that align with Full Spectrum Leadership ImperativesPreparation for and participation in major program design reviews (PDR, CDR)Experience troubleshooting and resolving technical issuesProven understanding of electronics standards and processesProven understanding of mechanical standards and processesProven understanding of electronic packaging principlesDemonstrated ability to multitask and adapt to changing prioritiesExperience with military defense hardwareExperience with parts and materials selectionsAbility to perform design trade studies evaluating cost, weight, packaging, and power benefitsFlex circuit and microelectronics design experienceActive DoD Secret or Top Secret ClearancePay InformationFull-Time Salary Range: $ - $ At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally.