Micron Technology, Inc. is seeking an experienced organizational leader to guide methodology improvements, data-driven decision-making, and AI/advanced analytics to drive innovation in advanced packaging for memory products.
You will steer end-to-end technology execution across HBM, 3DS DRAM, and emerging 3D architectures, influencing internal roadmaps and external ecosystems. You will lead cross-functional programs, mentor engineers, and collaborate across teams to deliver high-impact packaging
#J-18808-LjbffrDMTS Process Development Engineer — AI-Enabled Packaging in boise at Unknown Company
This position is listed as full time and onsite.