Director, Product Line Manager – Advanced Packaging & Metrology (E)

Company Overview

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The company focuses on innovation and invests 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. Life here is exciting and our teams thrive on tackling hard problems.

Job Description / Preferred Qualifications

The Product Line Manager (PLM) Director for Advanced Packaging & Metrology will drive product strategy, lifecycle management, and market analysis for next-generation semiconductor packaging and metrology solutions. This hybrid role blends technical depth with market insight, requiring leadership in both product management and strategic marketing and will be responsible for defining product strategy, driving customer adoption, and managing the full lifecycle of Advanced Packaging products. The ideal candidate will have extensive experience in advanced packaging, metrology, or inspection technologies, and a proven ability to lead and build cross-functional teams to deliver innovative solutions that meet evolving customer needs.

Responsibilities

• Product Strategy & Lifecycle Management
  • Define and own the product roadmap, including technical direction, feature prioritization, and strategic decisions on architecture and specifications.
  • Manage the full product lifecycle from concept through end-of-life, ensuring alignment with division goals and objectives.
  • Oversee project planning, scope, schedule, budget, and resource allocation.
  • Own the product line’s P&L, including revenue, margin, and cost structure.
  • Drive Balanced Scorecard metrics: cost, growth, customer satisfaction, and innovation.
  • Analyze market trends and technology inflections (e.g., 2.5D/3D integration, hybrid bonding, backside power delivery, chiplet architectures, fan-out packaging, co-packaged optics).
  • Conduct strategic market studies and competitive analysis to guide investment decisions and identify growth opportunities.
  • Evaluate and prioritize customer feature requests; translate market needs into actionable development plans.
  • Assess emerging technologies and forecast their growth potential.

Customer & Relationship Management

• Build and maintain strong relationships with customers, understanding their requirements and expectations.
• Drive product adoption and penetration in advanced packaging and metrology segments.
• Lead customer engagement strategies through Field Marketing and Applications Engineering.
• Act as the primary point of contact between customers and the division, supporting pre-sales and after-sales projects.

Cross-Functional Leadership & Global Collaboration

• Collaborate with R&D, Engineering, Sales, Marketing, Operations, and global teams to ensure successful product execution.
• Facilitate clear communication among project teams, stakeholders, and senior management, providing regular updates on status, risks, and mitigation plans.
• Champion product vision internally and externally.
• Engage with a global installed base, requiring approximately 30–40% business travel (domestic and international), based on business needs.

Required Qualifications

• Bachelor’s, Master’s, or PhD in Engineering, Physics, Materials Science, or related technical field.
• 10+ years of experience in product management, applications engineering, or technical marketing, preferably in the semiconductor or advanced packaging/metrology industry.
• Deep understanding of advanced packaging manufacturing processes and equipment (including 2.5D/3D packaging, hybrid bonding, chiplet architectures, fan-out packaging, CoWoS, SOIC, HBM and related metrology or inspection technologies).
• Experience with PLM tools, financial modeling, and customer engagement strategies.
• Proven ability to develop and execute market strategies and product roadmaps.
• Knowledge of wafer inspection technologies and tools.
• Strong analytical, communication, and leadership skills.
• Willingness and ability to travel internationally (30–40%).

Preferred Qualifications

• Experience working with global teams and diverse customer bases.
• Ability to translate technical concepts into business value.
• Familiarity with competitive analysis and strategic market development for advanced packaging products.

Minimum Qualifications

Doctorate (Academic) Degree and related work experience of 10 years; Master\u2019s Level Degree and related work experience of 13 years; Bachelor\u2019s Level Degree and related work experience of 15 years

Base Pay Range: $210,900.00 - $369,100.00

Primary Location: USA-CA-Milpitas-KLA

EEO / Benefits

KLA’s total rewards package for employees may include participation in performance incentive programs and eligibility for benefits including medical, dental, vision, life, 401(K) with company matching, ESPP, tuition reimbursement, development and career growth opportunities, and wellness programs. We are an Equal Opportunity Employer. We provide reasonable accommodation to qualified individuals with disabilities in the application process and job functions. If you need accommodation, contact or .

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