Renesas Electronics is seeking a senior packaging engineer to lead development and qualification of advanced power packaging, SiP and wafer-level technologies. You will oversee DOE, supplier collaboration with OSAT/CM, and ensure smooth ramp into production.
The role requires deep technical knowledge in power packaging, wire-bonding, and multi-chip modules, with an emphasis on reliability and process control within a global organization.
#J-18808-LjbffrDirector, Power SiP Packaging & Wafer-Scale Interconnect in austin at Unknown Company
This position is listed as full time and onsite.