Renesas Electronics in San Jose, CA, seeks a senior packaging leader focused on power SiP/module and wafer-level/flip-chip packaging. The role drives development, qualification, and production ramp with OSAT/CM partners, executes DOE programs, and defines technology roadmaps for reliable, scalable power packaging solutions.
The ideal candidate has 15–20 years in package development, deep knowledge of power SiP and interconnects, and strong communication and analytical skills to align engineering
#J-18808-LjbffrDirector, Power Packaging & SiP Innovation in san jose at Unknown Company
This position is listed as full time and onsite.