Renesas Electronics seeks an senior-level packaging expert to lead high-power SiP/module packaging development for AI/datacenter applications. You will drive process optimization, supplier collaboration, and robust qualification programs.
You will coordinate cross-functional teams across R&D, Product, and Quality to ensure on-time delivery and scalable packaging solutions. This role is on-site in the Phoenix area, with a focus on advancement of power packaging technologies and reliability.
#J-18808-LjbffrDirector, Power Packaging & SiP Innovation in phoenix at Unknown Company
This position is listed as full time and onsite.