Renesas Electronics is seeking a senior package technology engineer in Dallas to lead R&D for power SiP/module packaging, wafer-level and flip-chip technologies, and collaboration with OSAT/CM partners. The role shapes packaging roadmaps and drives process improvements across global teams.
The candidate will manage DOE programs, drive qualification, and coordinate with Product and Reliability groups to meet aggressive timelines while maintaining high quality standards.
#J-18808-LjbffrDirector, Power Packaging & SiP Innovation in dallas at Unknown Company
This position is listed as full time and onsite.