Thintronics is seeking a Director / Sr Director of Engineering, Advanced Packaging to lead integration of breakthrough materials into semiconductor packaging platforms. You will report to the CTO and shape the strategy, translating materials innovation into manufacturable solutions.
The role requires deep expertise, leadership of a large engineering organization across multiple disciplines, and close collaboration with customers, fabs, and OSAT partners.
#J-18808-LjbffrDirector of Advanced Packaging Engineering in california at Unknown Company
This position is listed as full time and onsite.