Renesas Electronics seeks a Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. You will drive R&D from concept through NPI to high-volume OSAT management, enabling AI and data center progress with Smart Power Stages and Wide Bandgap solutions.
You will oversee budgets, participate in customer adoption programs, and establish design rules to ensure manufacturability and reliability across global packaging platforms.
#J-18808-LjbffrDirector of Advanced IC Packaging & Power SiP Solutions in california at Unknown Company
This position is listed as full time and onsite.