Amkor seeks an experienced BU Product Manager for Advanced Chiplets/FCBGA packaging in Tempe, AZ. The role centers on program management and core customer account leadership, coordinating internal teams and supplier development to qualify and ramp production.
You will drive process development and cost analysis for NPIs while supporting existing customers. The ideal candidate has a strong background in semiconductor packaging, DOE/SPC experience, and proven project management skills, with the
#J-18808-LjbffrDirector, Chiplets Packaging Strategy & Programs in tempe at Unknown Company
This position is listed as full time and onsite.