Amkor Technology, Inc. is seeking a Business Unit Product Manager for Advanced Chiplets/FCBGA Packaging in Tempe, AZ. The role will focus on program management, key customer accounts, and driving internal process development. Candidates should have extensive experience in semiconductor packaging and excellent communication skills.
This position offers a hybrid work schedule and requires a Bachelor's degree in Engineering, with 10+ years of relevant industry experience. Key responsibilities include managing customer relationships, conducting cost analysis, and supporting product development.
#J-18808-LjbffrDirector, Chiplets & FCBGA Packaging PM in phoenix at Unknown Company
This position is listed as full time and hybrid.