A leading semiconductor solutions provider is seeking a Director, Chiplets and FCBGA, for their Tempe, AZ office. This role involves program management for advanced chiplet-based IC packages and coordinating with Tier 1 customers. Candidates should possess a Bachelor's in Engineering and over 10 years of semiconductor packaging experience. A hybrid schedule is available, and candidates must reside near the office or be willing to relocate. Strong communication and team management skills are essential.
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Director, Chiplet & FCBGA Integration in tempe at Unknown Company
This position is listed as full time and hybrid.