Micron Technology in Boise, Idaho is seeking a Process Integration Lead for Advanced Packaging. You will lead a team driving 2.5D/3D packaging development from concept to manufacturing and shape roadmaps for next‑gen platforms while mentoring highly skilled engineers.
You will collaborate with design, process, equipment, reliability, test and manufacturing teams to deliver scalable packaging solutions, optimize yield, and transfer technology into production.
#J-18808-LjbffrDirector, Advanced Packaging Process Integration (2.5D/3D) in boise at Unknown Company
This position is listed as full time and onsite.