Amkor Technology, Inc., the world’s largest U.S.-headquartered OSAT, seeks a Senior Director of Advanced Packaging and Wafer Services for Tempe, AZ. You will provide strategic leadership for advanced wafer-based IC packages, including 2.5D and chiplet architectures, and interface with Tier 1 customers, global R&D centers, and cross-functional teams to drive roadmaps and production ramp.
You will lead cross-functional teams across R&D, design, characterization, and operations, guiding technical
#J-18808-LjbffrDirector, Advanced Packaging & Wafer Solutions in tempe at Unknown Company
This position is listed as full time and onsite.