Amkor in Tempe, AZ seeks a senior Director of Advanced Packaging and Wafer Services to lead strategic customer engagements and drive commercialization of next-generation wafer-based IC packages, including 2.5D, chiplet architectures, and related technologies.
The role interfaces with Tier 1 customers, Amkor's global R&D centers, and cross-functional teams to steer roadmaps, program execution, and production ramp, with 10–20% travel. Hybrid work is offered in Tempe, AZ.
#J-18808-LjbffrDirector, Advanced Packaging & 2.5D/Wafer Solutions in tempe at Unknown Company
This position is listed as full time and hybrid.