GlobalFoundries Fab8 is seeking a highly skilled R&D TSV engineer to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.
You will lead TSV process development, define architectures, and drive end-to-end integration across fabrication and packaging stacks, advancing protoypes to manufacturable flows in a collaboration-heavy environment.
#J-18808-LjbffrCryogenic TSV Integration Engineer – Quantum Packaging in town of malta at Unknown Company
This position is listed as full time and onsite.