GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D bump process engineer to become part of our Quantum Advanced Packaging team. This role will entail driving next-generation interconnect scaling development efforts in our Advanced Packaging and Photonics Center (APPC) as well as with our partners.
The primary responsibility of this position is to own development and integration of cryogenic, superconducting bumping processes enabling scalable quantum hardware packaging.
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