Samsung Austin Semiconductor in Austin, TX seeks a Copper-to-Copper Bonding Expert to lead development and optimization of advanced wafer bonding for CMOS image sensors. You will enable first-of-a-kind C2C bonding and drive process integration to improve yield, performance and reliability.
You will own module integration, yield and reliability issues, lead projects to cure systematics, and guide changes reviewed by Change Control Board.
#J-18808-LjbffrC2C Bonding Module Architect in austin at Unknown Company
This position is listed as full time and onsite.