Samsung Austin Semiconductor seeks a Copper-to-Copper bonding expert to lead development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CIS applications.
You will drive innovations in hybrid bonding to enable stacked image sensors with superior yield, performance, and reliability, while coordinating with fab teams on process changes and risk assessment.
#J-18808-LjbffrC2C Bonding Engineer: BEOL Module Integration Lead in austin at Unknown Company
This position is listed as full time and hybrid.