Oversee the financial, strategic, and tactical execution of the semiconductor backend manufacturing cycle.
Lead end-to-end negotiation of Master Service Agreements (MSAs), Service Level Agreements (SLAs), and complex commercial contracts with global OSATs and backend vendors.
Own the operational relationship with OSAT partners and backend suppliers.
Manage backend operational budget, including OpEx, CapEx planning, and headcount management.
Oversee product ramp from the NPI phase to high-volume manufacturing for all packaging, assembly, and test operations.
Requirements
Bachelor’s or Master’s degree in Electrical/Electronics Engineering, Industrial Engineering, or Supply Chain Management.
12+ years of progressive leadership experience in semiconductor manufacturing, with specific expertise in Assembly, Test, and Backend operations.
Proven track record of executing multi-million dollar MSAs and managing large-scale procurement or strategic sourcing for semiconductor components.
Demonstrated success in P&L ownership, gross margin improvement, and strategic supplier negotiations.
Understanding of automated testing environments (ATE), semiconductor packaging technologies, and backend MES (Manufacturing Execution Systems).
High-stakes negotiation skills, exceptional cross-functional leadership, data-driven analytical capability, and ability to manage global teams.
Hard Skills
Assembly Operations
Test Operations
Backend Operations
P&L Ownership
Gross Margin Improvement
Strategic Sourcing
Data-Driven Analysis
Contract Management
Procurement Management
Headcount Management
Soft Skills
High-Stakes Negotiation Skills
Cross-Functional Leadership
Analytical Capability
Global Team Management
Certifications & Qualifications
Bachelor’s Degree in Electrical/Electronics Engineering
Master’s Degree in Electrical/Electronics Engineering