BGA - Ball Grid Array Technician

Job Description

Role Overview We are seeking a specialized Electronics Technician responsible for the rework, re-balling, and replacement of BGA (Ball Grid Array) devices and other complex packages. The successful candidate will ensure high-precision repairs bumps on BGA package, working with complex BGA package while adhering to industrial quality standards.

Key Responsibilities

· BGA Rework: Independently execute thermal profiles for the safe removal (desoldering) and repositioning of BGA components.

· Reballing / Ribumping: Reconfigure micro-solder balls on the BGA component matrix or the board pads.

· Inspection and Testing: Utilize X-ray inspection systems and optical microscopes to verify ball alignment and ensure the absence of solder bridges or short circuits.

· Cleaning and Preparation: Remove residual solder and flux from pads without causing delamination or damage to the board.

· ESD Quality Control: Operate in strict compliance with Electrostatic Discharge (ESD) safety regulations.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy:

Skills and Requirements

Core Requirements

· Experience: At least 3-5 years of proven experience in micro-soldering, reballing, and BGA rework on high-density electronic boards.

· Technical Proficiency: Skilled in using computerized BGA rework stations (hot air or infrared), soldering irons, microscopes, and X-ray systems.

· Material Knowledge: Strong familiarity with reflow thermal profiles, solder alloys (leaded and lead-free), and fluxes (No-Clean/Rosin).