RTX is seeking a multi-disciplinary Engineering Project Leader focused on microelectronics packaging and 2.5D/3D heterogeneous integration to increase RF/mixed-signal subsystem density. You will provide technical direction during CRAD programs and coordinate IRAD initiatives across Raytheon sites.
You will collaborate with engineers across disciplines, drive customer-focused proposals, and mentor teammates while managing portfolio investments and travel to customer sites.
#J-18808-LjbffrAssociate Director: Microelectronics Packaging & Strategy in mckinney at Unknown Company
This position is listed as full time and onsite.