Raytheon Advanced Technology in the United States is seeking a multi-disciplinary Engineering Project Leader to drive the strategy and development of a microelectronics packaging portfolio, including 2.5D and 3D heterogeneous integration to increase RF and mixed-signal density.
The role will guide program capture and CRAD execution, coordinate IRAD projects across programs, mentor engineers, manage budgets, and support transitions to operations.
#J-18808-LjbffrAssociate Director, 3D Microelectronics Packaging in tewksbury at Unknown Company
This position is listed as full time and onsite.