Amazon Inc. is seeking a Signal & Power Integrity Engineer for Annapurna Labs to advance SI/PI analyses for 2.5D/3D-IC packaging in next-gen data center ASICs.
In this role, you will support the package-level SI/PI effort with simulations, modeling, and design input across IC, package, and board boundaries. You will work closely with senior engineers to ensure performance targets and manufacturing requirements are met, contributing to robust power delivery and signal integrity in high-speed
#J-18808-LjbffrAdvanced Packaging SI/PI Engineer in omaha at Unknown Company
This position is listed as full time and onsite.