Micron Technology, Inc. in Boise, Idaho, is seeking a Process Integration Engineer for Advanced Packaging. You will develop and integrate 2.5D/3D packaging, including HBM and hybrid bonding, working across disciplines to improve performance and yield.
Responsibilities include experiments to qualify materials and processes, data-driven yield analysis, and technology transfer to manufacturing. Collaboration with design, process, reliability, and manufacturing teams is essential to deliver
#J-18808-LjbffrAdvanced Packaging Process Integration Engineer in boise at Unknown Company
This position is listed as full time and hybrid.