Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, Arizona seeks a Packaging Module Development Engineer to advance packaging processes, drive optimization, and qualification for high‑volume production.
You will design and execute experiments using SPC and DOE, collaborate with cross‑functional engineering, manufacturing, and product teams, and contribute to reliable, cost‑effective packaging solutions that scale globally.
#J-18808-LjbffrAdvanced Packaging Process Engineer: High-Impact in chandler at Unknown Company
This position is listed as full time and onsite.