Intel Corporation in Hillsboro, Oregon, is seeking a Module Development Engineer to advance semiconductor manufacturing capabilities. You will develop and optimize advanced processes, run feasibility studies, and enable high-volume production for next-generation device architectures.
This role emphasizes process innovation, cross-functional collaboration, and delivering scalable solutions to strengthen Intel's industry leadership.
#J-18808-LjbffrAdvanced Packaging Module Engineer: Plating & Process Innovation in hillsboro at Unknown Company
This position is listed as full time and onsite.