Intel in Phoenix, AZ is seeking a Package Assembly Process Development Integration Engineer to drive development activities and manage data collection for TV and product programs. You will lead DOE plans, address process issues, and coordinate substrate/material strategies to control costs and schedules.
You will work with a broad set of stakeholders across a highly networked organization, delivering robust die-package solutions and contributing to device yield improvements. #J-18808-Ljbffr
You will work with a broad set of stakeholders across a highly networked organization, delivering robust die-package solutions and contributing to device yield improvements. #J-18808-Ljbffr
Advanced Packaging Development & Integration Engineer in chandler at Unknown Company
This position is listed as full time and onsite.