SAIC is seeking an Advanced Packaging Engineer to support missile system hardware design and analysis. You will collaborate with multidisciplinary teams to develop and validate advanced microelectronics packaging solutions for complex defense systems.
The role involves mechanical modeling, finite element analysis, thermal fatigue, and systems engineering across the lifecycle, with opportunities for growth and security clearances.
#J-18808-LjbffrAdvanced Microelectronics Packaging Engineer in town of texas at Unknown Company
This position is listed as full time and onsite.