A leading semiconductor foundry is seeking a 3D Heterogeneous Integration Engineer to join the Advanced Packaging Lab. The successful candidate will drive process development for packaging solutions, collaborate on joint projects, and provide mentorship to new hires. Required qualifications include a Master's degree in a related field and at least 5 years of experience. Knowledge of BEOL processes is essential. This role offers a salary range of $98,000 to $176,000, commensurate with experience and qualifications.
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Advanced 3D Heterogeneous Integration Engineer in town of malta at Unknown Company
This position is listed as full time and onsite.