GLOBALFOUNDRIES U.S. INC. is seeking an experienced R&D engineer to lead Advanced Packaging Lab 3D-HI initiatives, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development.
The role involves driving process development across multiple programs, partnering with process, manufacturing, and vendor teams, and mentoring newer engineers while delivering IP on wafer integration and packaging technologies.
#J-18808-Ljbffr3D-HI Process Engineer for Advanced Packaging R&D in town of malta at Unknown Company
This position is listed as full time and onsite.